One-Stop Energy Storage Auxiliary Materials Supplier
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Doc No.: GS-TDS-C300-EN
Issue Date: March 2026 | Ver: V1.0
The C-300 series is a thermally conductive silicone pad based on a silicone polymer matrix, manufactured by incorporating high thermal conductivity fillers through a specialized process. It is specifically designed to fill the gap between heat sources (chips, etc.) and heat sinks, frames, or base plates for efficient thermal conduction. The product's soft, elastic, and naturally tacky surface ensures consistently good wettability at the interface, effectively reducing interfacial thermal resistance.
| Item | Unit | Spec | Detection Method |
|---|---|---|---|
| Color | — | Gray / Light Blue / Pink | Visual Inspection |
| Thickness | mm | 0.3 – 10 | ASTM D374 |
| Hardness | Shore C | 25 – 80 | ASTM D2240 |
| Specific Gravity | — | 3.05 ± 0.1 | ASTM D792 |
| Thermal Conductivity | W/m·K | 3.0 ± 0.2 | ASTM D5470 |
| Volume Resistivity | Ω·cm | > 1.0 × 10¹¹ | ASTM D257 |
| Dielectric Strength | kV/mm | ≥ 4 | ASTM D149 |
| Dielectric Constant (1 MHz) | — | 3 – 8 | ASTM D150 |
| Working Temperature | °C | -40 ~ +200 | IEC 60068-2 |
| Flame Retardancy | — | UL94 V-0 | UL94 |
| Standard Sheet Size | mm | 200 × 400 | Ruler / Caliper |
* All values represent typical data under standard laboratory conditions. Custom thickness, size, and hardness available upon request.