Back to Products

GESON SUPPLY

One-Stop Energy Storage Auxiliary Materials Supplier

Email: kyle@gesonco.com  |  WhatsApp: +86 188 5766 5584  |  www.gesonco.com

TECHNICAL DATA SHEET

Doc No.: GS-TDS-LCDRJ-EN

Issue Date: March 2026  |  Ver: V1.0

Thermally Conductive Double-Sided Tape  |  LC-DRJ Series (010B – 050B)

Fiberglass Substrate  /  Thermal Conductivity 1.0 W/m·K  /  7 Thickness Options
1. Product Description

The LC-DRJ series is a range of thermally conductive double-sided adhesive tapes engineered for heat dissipation bonding in electronics and energy storage applications. Built on a 0.04 mm white fiberglass substrate with a blue release liner, these tapes provide a thermal conductivity of 1.0 W/m·K and are available in seven adhesive thickness options from 0.10 mm to 0.50 mm to suit varying gap-fill and bonding requirements. Both adhesive sides (Side A and Side B) are independently characterized, allowing precise selection for asymmetric bonding interfaces. The series offers excellent dielectric strength, reliable long-term adhesion, and a service temperature range of -20°C to 100°C (short-term: 120°C).

2. Product Construction
Side A — AdhesiveThermally Conductive PSA
SubstrateFiberglass (White) — 0.04 mm
Side B — AdhesiveThermally Conductive PSA
Release LinerBlue Film — 0.08 mm
Common Construction Parameters (All Models)
SubstrateFiberglass (White)
Substrate Thickness0.04 mm
Release LinerBlue Film
Liner Thickness0.08 mm
Thermal Conductivity1.0 ± 0.02 W/m·K
Long-Term Temp. Range-20°C to 100°C
Short-Term Max. Temp.120°C
Shelf Life12 months
3. Technical Data — Model Comparison
Item Unit Side 010B 015B 020B 025B 030B 040B 050B Test Method
Adhesive Thickness mm 0.100.150.200.250.300.400.50 ASTM D374
Initial Tack (Steel Ball) A >8#>8#>10#>18#>20#>21#>22# GB/T 4852
B >12#>12#>15#>20#>22#>23#>24#
Peel Adhesion (180°) gf/25mm A >1500>1600>1700>1900>2000>2100>2200 GB/T 2792
B >1300>1400>1500>1700>1800>1900>2100
Holding Power (Shear) H A ≥24H≥24H≥48H≥48H≥48H≥48H≥48H GB/T 4851
B ≥24H≥24H≥48H≥48H≥48H≥48H≥48H
Dielectric Breakdown Voltage kV/mm 2.53.03.54.56.06.57.0 ASTM D149
Thermal Conductivity W/m·K 1.0 ± 0.02 (All Models) ASTM D5470
Thermal Resistance °C·in²/W <1.10<1.30<1.75<2.10<2.65<3.12<4.60 ASTM D5470
Long-Term Service Temp. °C -20°C to 100°C (All Models) EN 344
Short-Term Max. Temp. °C 120°C (All Models) EN 344

* Side A = adhesive side facing away from release liner. Side B = adhesive side facing the blue release liner. All values are average results from laboratory testing. Independent testing is recommended prior to use.

4. Key Features
Thermal conductivity 1.0 W/m·K — effective heat transfer bonding
7 thickness options (0.10–0.50 mm) — flexible gap-fill selection
High dielectric strength up to 7.0 kV/mm (LC-DRJ050B)
Dual-side independent adhesion characterization (Side A & B)
Fiberglass substrate — dimensional stability and tear resistance
Long-term service: -20°C to 100°C; short-term up to 120°C
Strong shear holding power ≥ 48H (models 020B and above)
12-month shelf life; custom slit sizes available
5. Typical Applications
Battery cell-to-heatsink bonding in ESS packs
BMS board thermal interface attachment
LED module heat dissipation bonding
Power module and IGBT mounting
Inverter and charger component assembly
Consumer electronics thermal management