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TECHNICAL DATA SHEET

Doc No.: GS-TDS-XHTMS50120-EN

Issue Date: March 2026  |  Ver: V1.0

PI Gold Finger Tape  |  XHTMS-50120  — Kapton / Silicone Adhesive

High-Temperature Masking  /  Wave Soldering Protection
1. Product Description

XHTMS-50120 is a high-performance polyimide (PI / Kapton) tape coated with silicone pressure-sensitive adhesive, engineered for high-temperature masking and protection in electronics manufacturing. The 50 μm Kapton film substrate provides outstanding thermal stability, dielectric strength, and mechanical toughness, while the silicone adhesive ensures clean removal with zero residue after exposure to soldering temperatures up to 260–280°C. It is widely used for gold finger protection during wave soldering, PCB masking during reflow, and shielding of chassis and cabinet components during high-temperature spray coating processes.

2. Product Construction
Substrate Polyimide Film (Kapton) — 0.05 mm
Adhesive Silicone PSA — 0.07 mm
Construction Parameters
Substrate Polyimide Film (Kapton)
Adhesive Type Silicone (Pressure-Sensitive)
Film Thickness 0.05 mm
Adhesive Thickness 0.07 mm
Total Thickness 0.12 ± 0.003 mm
3. Technical Data
Item Unit Spec / Value Test Method
Total Thickness mm 0.12 ± 0.003 GB/T 7125-1998
Film (Substrate) Thickness mm 0.05 GB/T 7125-1997
Peel Adhesion N/25mm 6 ± 1 GB/T 2792-1997
Tensile Strength N/25mm 135 ± 30 GB 7753-1986
Elongation at Break % 70 ± 20 GB 7753-1986
Dielectric Breakdown Voltage kV 6
Heat Resistance °C / min 260 – 280°C / 30 min Constant Temp. Oven
Residue after Removal None Visual Inspection

* All values are typical data measured under standard conditions. Not guaranteed values.

4. Key Features
Kapton (PI) substrate — outstanding thermal stability up to 280°C
Silicone adhesive — clean removal, zero residue after soldering
High dielectric strength — 6 kV breakdown voltage
Excellent tensile strength (135 ± 30 N/25mm) — resistant to tearing
Soft and conformable — fits complex PCB geometries
Strong holding force during wave soldering and reflow processes
Uniform surface — no bubbles, pinholes, or wrinkles
Available in custom widths and lengths
5. Typical Applications
Gold finger protection during PCB wave soldering
PCB component masking during reflow soldering
High-temperature spray coating masking for chassis & cabinets
Battery pack FPC & BMS board insulation protection
Transformer and motor coil insulation wrapping
High-voltage component insulation in ESS assemblies
6. Appearance Requirements

The tape surface shall be uniform and free from defects including air bubbles, pinholes, creases, wrinkles, and blemishes. Each roll shall be wound evenly without edge damage or telescoping. Inspections shall be carried out in accordance with GB/T 7125, GB/T 2792, and GB/T 7752.

7. Packaging

Each roll is individually wrapped in a plastic film inner layer and packed in a corrugated carton outer box. Custom roll widths, lengths, and core sizes are available upon request.

8. Storage & Shelf Life

Store rolls upright or flat in original packaging. Recommended storage conditions: temperature 18–28°C, relative humidity 45–75% RH, in a dry, clean, and well-ventilated environment away from direct sunlight, open flames, and heat sources. Shelf life: 6 months from date of manufacture. Product may still be used after 6 months if re-tested and confirmed to meet all specification requirements. For best performance, use within 2 months of receipt.